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SHINDENGEN General Purpose Rectifiers SIL Bridges D15XB80 800V 15A FEATURES *oe Single In-Line Package Thin *oe High current capacity with Small Package *oe High IFSM *oe Superior Thermal Conductivity APPLICATION OUTLINE DIMENSIONS Case : 5S Unit : mm *oe power supply Switching *oe Home Appliances, Office Equipment *oe Factory Automation, Inverter RATINGS *oe* Absolute Maximum Ratings (If not specified Tc=25*Z) @ Item Symbol Conditions Ratings Storage Temperature Tstg -40*150 Operating Junction Temperature Tj 150 Maximum Reverse Voltage VRM 800 IO 50Hz sine wave, R-load With heatsink Average Rectified Forward Current Tc=100*Z 15 50Hz sine wave, R-load Without heatsink Ta=25*Z 3.2 Peak Surge Forward CurrentIFSM 50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25*Z 200 2 Current Squared Time I t 1ms*...t*10ms*@Tj=25*Z 110 Dielectric Strength Vdis Terminals to case, AC 1 minute 2.5 Mounting Torque R i TOR * ecommended torque : 0.5Nm*j 0.8 *oe* Electrical Characteristics (If not specified Tc=25*Z) @ Item Symbol Conditions VF I =7.5A, Pulse measurement, Rating of per diode Forward Voltage F IR V=V , Pulse measurement, Rating of per diode Reverse Current R RM AEjc junction to case * * With heatsink @@ Thermal Resistance AEjl junction to lead * * Without heatsink @@ AEja junction to ambient Without heatsink Unit *Z *Z V A A A2 s kV Nm Ratings Unit Max.1.1 V Max.10 EA Max.1.5 Max.5 *Z/W Max.22 Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd D15XBx Forward Voltage 10 Forward Current IF [A] Tc=150C [TYP] Tc=25C [TYP] 1 Pulse measurement per diode 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 Forward Voltage VF [V] D15XBx 60 Forward Power Dissipation SIN Forward Power Dissipation PF [W] 50 40 30 20 10 0 0 5 10 15 20 25 Average Rectified Forward Current IO [A] Tj = 150C Sine wave D15XBx 20 Derating Curve Heatsink Tc Tc Average Rectified Forward Current IO [A] SIN 15 10 5 0 80 90 100 110 120 130 140 150 160 Case Temperature Tc [C] Sine wave R-load with heatsink D15XBx 5 Derating Curve Average Rectified Forward Current IO [A] 4 SIN 3 PCB Glass-epoxy substrate Soldering land 5mm 2 1 0 0 20 40 60 80 100 120 140 160 Ambient Temperature Ta [C] Sine wave R-load Free in air D15XBx 250 Peak Surge Forward Capability IFSM 10ms 10ms 1 cycle 200 Peak Surge Forward Current IFSM [A] non-repetitive, sine wave, Tj=25C before surge current is applied 150 100 50 0 1 2 5 10 20 50 100 Number of Cycles [cycles] |
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